Technical Program

Paper Detail

Paper:MO-UA.1P.4
Session:Materials and Packaging
Location:Regatta
Session Time:Monday, July 10, 13:20 - 15:00
Presentation Time:Monday, July 10, 14:20 - 14:40
Presentation: Oral
Paper Title: Printed Interconnects between Components for Microwave Applications
Authors: Elicia Harper, Craig Armiento, University of Massachusetts Lowell, United States; Susan Trulli, Raytheon IDS, United States; Alkim Akyurtlu, University of Massachusetts Lowell, United States; Christopher Laighton, Raytheon IDS, United States