Paper: | MO-UA.1P.4 | ||
Session: | Materials and Packaging | ||
Session Time: | Monday, July 10, 13:20 - 15:00 | ||
Presentation Time: | Monday, July 10, 14:20 - 14:40 | ||
Presentation: | Oral | ||
Paper Title: | Printed Interconnects between Components for Microwave Applications | ||
Authors: | Elicia Harper, Craig Armiento, University of Massachusetts Lowell, United States; Susan Trulli, Raytheon IDS, United States; Alkim Akyurtlu, University of Massachusetts Lowell, United States; Christopher Laighton, Raytheon IDS, United States |